| Issue |
J. Eur. Opt. Soc.-Rapid Publ.
Volume 13, Number 1, 2017
|
|
|---|---|---|
| Article Number | 22 | |
| Number of page(s) | 9 | |
| DOI | https://doi.org/10.1186/s41476-017-0050-z | |
| Published online | 09 September 2017 | |
Research
Development of multi-pitch tool path in computer-controlled optical surfacing processes
1
School of Mechatronics Engineering, Harbin Institute of Technology, 150001, Harbin, China
2
Research Center of Laser Fusion, China Academy of Engineering Physics, 621900, Mianyang, China
Received:
14
June
2017
Accepted:
24
August
2017
Background: Tool path in computer-controlled optical surfacing (CCOS) processes has a great effect on middle spatial frequency error in terms of residual ripples. Raster tool path of uniform path pitch is one of the mostly adopted paths, in which smaller path pitch is always desired for restraining residual ripple errors. However, too dense paths cause excessive material removal in lower removal regions deteriorating the form convergence.
Methods: With this in view, we propose a novel tool path planning method named multi-pitch path. With the path, the material removal map is divided into several regions with varied path pitches according to the desired removal depth in each region. The path pitch is designed larger at low removal regions while smaller at high removal regions, and the feeding velocity of the tool is maintained at high level when scanning the whole surface.
Results and conclusions: Experiments were conducted to demonstrate this novel tool path planning method, and the results indicate that it can successfully restrain the residual ripples, and meanwhile guarantee favorable convergent rate of form error.
Key words: Multi-pitch tool path / Middle spatial frequency error / Residual ripple / Removal regions
© The Author(s) 2017
Open Access This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.
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