The Citing articles tool gives a list of articles citing the current article. The citing articles come from EDP Sciences database, as well as other publishers participating in CrossRef Cited-by Linking Program. You can set up your personal account to receive an email alert each time this article is cited by a new article (see the menu on the right-hand side of the abstract page).
This article has been cited by the following article(s):
Research progress in chemical mechanical polishing (CMP) of silicon wafers for integrated circuits
Zuozuo Wu, Zhonghua Zhu, Yiting Li, Daming Wang, Yangjian Li, Shuai Yuan, Jianwei Cao and Deren Yang The International Journal of Advanced Manufacturing Technology 143(9-10) 4655 (2026) https://doi.org/10.1007/s00170-026-17714-5
In-situ monitoring and regulation of surface shape in swing fixed abrasive lapping of BK7 glass
Measurement of Contact Pressure Distribution Map at Workpiece/tin Lap Interface and Process Parameters Optimization During Full-Aperture Polishing With Tin Lap
Lele Ren, Feihu Zhang, Defeng Liao, Shijie Zhao, Ruiqing Xie, Jian Wang and Qiao Xu ECS Journal of Solid State Science and Technology 9(4) 044011 (2020) https://doi.org/10.1149/2162-8777/ab902d
Defeng Liao, Ruiqing Xie, Shijie Zhao, Lele Ren, Yiren Wang, William T. Plummer, Bin Fan, Xiong Li, Xiangang Luo, Mingbo Pu and Yongjian Wan 121 (2019) https://doi.org/10.1117/12.2505902
Surface shape development of the pitch lap under the loading of the conditioner in continuous polishing process
Defeng Liao, Ruiqing Xie, Shijie Zhao, Lele Ren, Feihu Zhang, Jian Wang and Qiao Xu Journal of the American Ceramic Society 102(6) 3129 (2019) https://doi.org/10.1111/jace.16178
In situ monitoring and controlling surface shape of the polishing pad in continuous polishing