Issue |
J. Eur. Opt. Soc.-Rapid Publ.
Volume 8, 2013
|
|
---|---|---|
Article Number | 13019 | |
Number of page(s) | 4 | |
DOI | https://doi.org/10.2971/jeos.2013.13019 | |
Published online | 10 March 2013 |
Regular papers
Direct machining of curved trenches in silicon with femtosecond accelerating beams
Département d’Optique P.M. Duffieux, Institut FEMTO-ST, UMR 6174 CNRS Université de Franche-Comté, 25030 Besançon Cedex, France
* francois.courvoisier@femto-st.fr
Received:
30
November
2012
Control of the longitudinal profile of ablated structures during laser processing is a key technological requirement. We report here on the direct machining of trenches in silicon with circular profiles using femtosecond accelerating beams. We describe the ablation process based on an intensity threshold model, and show how the depth of the trenches can be predicted in the framework of a caustic description of the beam.
Key words: Accelerating beams / airy beams / femtosecond laser micromachining
© The Author(s) 2013. All rights reserved.
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