Solderjet bumping packaging technique optimization for the miniaturization of laser devicesP. Ribes-Pleguezuelo, B. Septriani, S. Zhang, E. Beckert, R. Eberhardt, F. Wyrowski and A. TünnermannJ. Eur. Opt. Soc.-Rapid Publ., 13 1 (2017) 34DOI: https://doi.org/10.1186/s41476-017-0063-7
