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Cited article:

Solderjet bumping packaging technique optimization for the miniaturization of laser devices

P. Ribes-Pleguezuelo, B. Septriani, S. Zhang, E. Beckert, R. Eberhardt, F. Wyrowski, A. Tünnermann

J. Eur. Opt. Soc.-Rapid Publ., 13 1 (2017) 34

Published online: 2017-11-06

DOI: https://doi.org/10.1186/s41476-017-0063-7

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